Wafer-Level Chip-Scale Packaging

Name: Wafer-Level Chip-Scale Packaging
Brand: Springer-Verlag New York Inc.
SKU: 9781493915552
Price: 624.54 PLN
Availability: InStock

Analog and Power Semiconductor Applications

Autor: Shichun Qu, Yong Liu

Język:

Oprawa: Twarda

Wydawca: Springer-Verlag New York Inc.

Dostępność: Dostępna u dostawcy

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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in a...

Informacje o książce

Autor

Shichun Qu, Yong Liu

Język

Angielski

Oprawa

Książka - Twarda

Data wydania

2014

strony

322

EAN

9781493915552

ISBN

149391555X

Enbook ID

02780828

Wydawca

Springer-Verlag New York Inc.

Waga

6944

Wymiary

155 x 235 x 24

Pełny opis

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

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Wafer-Level Chip-Scale Packaging

Analog and Power Semiconductor Applications

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