Książka Through Silicon Vias Brajesh Kumar Kaushik

Through Silicon Vias

Język: Angielski
Oprawa: Twarda
Dostępność: 50 % szansa
Przeszukamy cały świat
1 161.76
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend thr...

Informacje o książce

Język
Angielski
Oprawa
Książka - Twarda
Data wydania
2016
strony
216
EAN
9781498745529
ISBN
9781498745529
Enbook ID
10041079
Waga
498
Wymiary
253 x 165 x 18

Pełny opis

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

Możesz być zainteresowany

Towards a Sustainable Asia

ssociation of Academies of Sciences in
472.89

Wolf That I Am

Fred McTaggart
124.56
156.93
128.70
429.36

Klienci, którzy kupili tę książkę, kupili również

Eisenbahnbau

Jörg Zimmermann
256.33

Du Marasme Dramatique En 1819

Jean-Toussaint Merle
64.74

Total angesagt

Karin Hartewig
32.76

THE HOMEWORK BLUES (CD)

ELIZABETH CAMPBELL
165.91

Tkanje života

Mirjana Krizmanić
51.32