Książka Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications Vikrant Bhateja

Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3

Język: Angielski
Oprawa: Twarda
Wydawca: Springer, Berlin
Dostępność: Dostępna u dostawcy
Wysyłamy za 10-13 dni
1 292.29
This book discusses the latest developments and outlines future trends in the fields of microelectro...

Informacje o książce

Język
Angielski
Oprawa
Książka - Twarda
Data wydania
2026
strony
306
EAN
9783032203175
Enbook ID
51248420
Waga
992
Wymiary
155 x 235

Pełny opis

This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2025), held in London, during October 2025. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today s society.

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