Książka Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications Vikrant Bhateja

Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 3

Język: Angielski
Oprawa: Twarda
Wydawca: Springer, Berlin
Dostępność: Dostępna u dostawcy
Wysyłamy za 10-13 dni
1 200.38
The book discusses the latest developments and outlines future trends in the fields of microelectron...

Informacje o książce

Język
Angielski
Oprawa
Książka - Twarda
Data wydania
2025
strony
500
EAN
9789819672486
Enbook ID
48422164
Waga
1229
Wymiary
155 x 235

Pełny opis

The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2024), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India, during 19-20 December 2024. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today's society.

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