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Książka Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture E.H. Wong

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Autor: E.H. Wong, S.K. Woon, Y. W. Mai
Język: Angielski
Oprawa: Twarda
Wydawca: Elsevier Science & Technology
Dostępność: Na zamówienie
Wysyłamy za 28-34 dni
787.95 zł
The reliability of components is a prime concern to electronics manufacturers and the failure of mic...

Informacje o książce

Autor
E.H. Wong, S.K. Woon, Y. W. Mai
Język
Angielski
Oprawa
Książka - Twarda
Data wydania
2015
strony
482
EAN
9781845695286
ISBN
1845695283
Enbook ID
05098486
Wydawca
Elsevier Science & Technology
Waga
830
Wymiary
152 x 229 x 30

Pełny opis

The reliability of components is a prime concern to electronics manufacturers and the failure of microelectronic packaging is a major source of component faults. Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research. This practical guide discusses theoretical aspects, experimental results, modeling techniques and results. The authors have used their extensive experience to produce detailed chapters covering temperature, moisture and mechanical shock induced failure in addition to adhesive interconnects and viscoelasticity. Useful program files and macros are included.

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