Książka 3D Interconnect Architectures for Heterogeneous Technologies Lennart Bamberg

3D Interconnect Architectures for Heterogeneous Technologies

Modeling and Optimization

Język: Angielski
Oprawa: Twarda
Wydawca: Springer, Berlin
Dostępność: Dostępna u dostawcy
Wysyłamy za 10-13 dni
517.88
This book describes the first comprehensive approach to the optimization of interconnect architectur...

Informacje o książce

Język
Angielski
Oprawa
Książka - Twarda
Data wydania
2022
strony
395
EAN
9783030982287
Enbook ID
38720713
Waga
766
Wymiary
155 x 235 x 28

Pełny opis

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow's 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.

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