Integrated Circuit Packaging, Assembly and Interconnections

Name: Integrated Circuit Packaging, Assembly and Interconnections
Brand: Springer-Verlag New York Inc.
SKU: 9781441939234
Price: 469.4 PLN
Availability: InStock

Autor: William Greig

Język:

Oprawa: Miękka

Wydawca: Springer-Verlag New York Inc.

Dostępność: Dostępna u dostawcy

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Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, ser...

Informacje o książce

Autor

William Greig

Język

Angielski

Oprawa

Książka - Miękka

Data wydania

2010

strony

300

EAN

9781441939234

ISBN

1441939237

Enbook ID

01422466

Wydawca

Springer-Verlag New York Inc.

Waga

498

Wymiary

155 x 235 x 18

Pełny opis

Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.§The focus is on the electronic manufacturing process which, in its simplest form, involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes. §This material will provide a suitable knowledge-base essential for individuals who have the need or interest in understanding the basics of electronic manufacturing.

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