Integrated Circuit Failure Analysis - A Guide to Preparation Techniques

Name: Integrated Circuit Failure Analysis - A Guide to Preparation Techniques
Brand: John Wiley & Sons Inc
SKU: 9780471974017
Price: 859.85 PLN
Availability: InStock

Autor: Friedrich Beck

Język:

Oprawa: Twarda

Wydawca: John Wiley & Sons Inc

Dostępność: Dostępna u dostawcy

Wysyłamy za 10-18 dni

859.85 zł

Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in...

Informacje o książce

Autor

Friedrich Beck

Język

Angielski

Oprawa

Książka - Twarda

Data wydania

1998

strony

190

EAN

9780471974017

ISBN

0471974013

Enbook ID

04895159

Wydawca

John Wiley & Sons Inc

Waga

396

Wymiary

162 x 239 x 16

Pełny opis

Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. Advice on the choice of suitable laboratory equipment. Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text will enable both academic and industrial researchers and IC designers to expand the range of analytical and preparative methods at their disposal and to adapt to the needs of new technologies.

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Integrated Circuit Failure Analysis - A Guide to Preparation Techniques

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