High Frequency Interconnect Characterization and Modeling

Name: High Frequency Interconnect Characterization and Modeling
Brand: VDM Verlag
SKU: 9783639130959
Price: 254.09 PLN
Availability: InStock

For VLSI On-Chip Interconnects and RF Package Wire Bonds

Autor: Xiaoning Qi

Język:

Oprawa: Miękka

Wydawca: VDM Verlag

Dostępność: Dostępna u dostawcy

Wysyłamy za 9-15 dni

254.09 zł

Continuous scaling of transistors combined with§increased chip area results in the ratio of global§w...

Informacje o książce

Autor

Xiaoning Qi

Język

Angielski

Oprawa

Książka - Miękka

Data wydania

2009

strony

132

EAN

9783639130959

ISBN

3639130952

Enbook ID

06821831

Wydawca

VDM Verlag

Waga

204

Wymiary

152 x 229 x 8

Pełny opis

Continuous scaling of transistors combined with§increased chip area results in the ratio of global§wire delay to gate delay increasing at a super-linear§rate. Simple RC models have become inadequate for§simulation of VLSI circuits. In addition, parasitic§inductance and capacitance of IC packages impose§limits on the circuit performance at RF frequencies.§This book presents modeling of on-chip inductance for§chips with ground grids that emulate those used in§real circuits. S-parameter characterization of test§chips up to 10 GHz shows good agreement with§simulation and analytical calculations. On-chip 3-D§capacitance modeling capabilities for arbitrarily§shaped objects are also presented. In addition, an§approach to fast 3-D modeling of the geometry for§bonding wires in RF circuits and packages is§demonstrated. The geometry and an equivalent circuit§are presented to model the frequency response of§bonding wires. Excellent agreement between modeled§results and measured data is achieved for frequencies§up to 10 GHz. The book should be useful to the§semiconductor professionals in academia and industry,§who are interested in the on-chip and package§interconnects researches.

Możesz być zainteresowany

Klienci, którzy kupili tę książkę, kupili również

Najczęściej wyszukiwane

Categories

Authors

Publishers

Produkty

Produkty

Najczęściej wyszukiwane

Categories

Authors

Publishers

Produkty

Produkty

High Frequency Interconnect Characterization and Modeling

For VLSI On-Chip Interconnects and RF Package Wire Bonds

Informacje o książce

Pełny opis

Możesz być zainteresowany

Klienci, którzy kupili tę książkę, kupili również