Książka Encapsulation Materials for Neural Interface Devices Jui-Mei Hsu

Encapsulation Materials for Neural Interface Devices

Autor: Jui-Mei Hsu
Język: Angielski
Oprawa: Miękka
Wydawca: VDM Verlag
Dostępność: Dostępna u dostawcy
Wysyłamy za 9-15 dni
292.66
Neural interface devices have been developed for §neuroscience and neuroprosthetics applications to...

Informacje o książce

Autor
Język
Angielski
Oprawa
Książka - Miękka
Data wydania
2009
strony
184
EAN
9783639140750
ISBN
3639140753
Enbook ID
06822710
Wydawca
Waga
277
Wymiary
152 x 229 x 11

Pełny opis

Neural interface devices have been developed for §neuroscience and neuroprosthetics applications to §record and stimulate nerve signals. Chronic use of §these devices is prevented by their lack of long-§term stability, due to device failure or immune §system responses. §Conformal, hermetic, biocompatible, and electrically §insulating coating materials that sustain chronic §implantation and guarantee stable recording or §stimulation are needed. Even though a large §selection of materials has been proposed and tested §for this purpose, to date, no material §presented in scientific literature has been §thoroughly characterized and qualified as a long-§term hermetic encapsulation material for silicon-§based neural interface devices. §In this work, hydrogenated amorphous silicon carbide §(a-SiCx:H) and Parylene-C films were investigated as §the encapsulation materials. The deposition §parameters and corresponding film properties were §explored and correlated with the encapsulation §characteristics.

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