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Electronic Packaging Materials Science X: Volume 515

Name: Electronic Packaging Materials Science X: Volume 515
Brand: Materials Research Society
SKU: 9781558994218
Price: 109.68 PLN
Availability: PreOrder

Autor: Daniel J. BeltonMichael GaynesElizabeth G. JacobsRaymond Pearson

Język:

Oprawa: Twarda

Wydawca: Materials Research Society

Dostępność: Dodruk

Termin nieznany

109.68 zł

Advanced packaging applications are demanding increasingly more innovative materials sets in order t...

Informacje o książce

Autor

Daniel J. BeltonMichael GaynesElizabeth G. JacobsRaymond Pearson

Język

Angielski

Oprawa

Książka - Twarda

Data wydania

1998

strony

262

EAN

9781558994218

ISBN

1558994211

Enbook ID

02060166

Wydawca

Materials Research Society

Waga

614

Wymiary

157 x 234 x 23

Pełny opis

Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability. In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability. This book explores the questions of materials, processes and reliability for high-density package solutions. The book is strengthened by invited and contributed papers from a host of national and international experts. Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.

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