Development and Packaging of Microsystems Using Foundry Services

Name: Development and Packaging of Microsystems Using Foundry Services
Brand: Biblioscholar
SKU: 9781286866931
Price: 99.15 PLN
Availability: InStock

Autor: Jeffrey T Butler

Język:

Oprawa: Miękka

Wydawca: Biblioscholar

Dostępność: Dostępna u dostawcy

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Micro-electro-mechanical systems (MEMS) is a relatively new and rapidly growing field of research. S...

Informacje o książce

Autor

Jeffrey T Butler

Język

Angielski

Oprawa

Książka - Miękka

Data wydania

2012

strony

328

EAN

9781286866931

ISBN

9781286866931

Enbook ID

08218417

Wydawca

Biblioscholar

Waga

585

Wymiary

189 x 246 x 18

Pełny opis

Micro-electro-mechanical systems (MEMS) is a relatively new and rapidly growing field of research. Several advances to the MEMS and microsystem state of the art were achieved through the design and characterization of novel MEMS devices and packaging, which are compatible with CMOS microelectronics. Empirical and theoretical models of polysilicon thermal actuators were developed to understand and simulate the behavior of thermal actuators. These models can be implemented in microelectronic circuit simulators such as SPICE and allow the simultaneous simulation of thermally actuated MEMS and microelectronics. The most extensive investigation of the Multi-User MEMS Processes (MUMPs) polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity (TCR) of the MUMPs Poly 1 layer was determined as 1.25 x 10-3 K-1. In addition, the sheet resistance of all the MUMPs polysilicon layers was found to be dependent on the linewidth due to the presence or absence of lateral phosphorus diffusion.

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