Angielski
With a focus on the use of materials characterization techniques for silicon-based semiconductors, this volume in the Materials Characterization series focuses on the process flow of silicon wafer manufacture where materials properties, processing and associated problems are brought to the fore. The book is organized by the types of materials commonly associated with integrated silicon semiconductor circuits and the typical processes involved for each such material, including deposition, thermal treatment, and lithography. Readers will find features such as:§The essential processes of Silicon Epitaxial §Growth Coverage of Polysilicon Conductors, Silicides, Aluminum and Copper-based Conductors, Tungsten-based Conductors §Concise summaries of major characterization technologies for silicon and related semiconductor materials, including Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, Neutron Activation Analysis and Raman Spectroscopy
