Against the Power Wall

Name: Against the Power Wall
Brand: VDM Verlag
SKU: 9783639261233
Price: 210.36 PLN
Availability: InStock

Floorplanning and Interconnecting on Chips

Autor: Renshen Wang

Język:

Oprawa: Miękka

Wydawca: VDM Verlag

Dostępność: Na zamówienie

Wysyłamy za 17-27 dni

210.36 zł

Computer performance has been growing at an exponential rate, in its golden age, driven by the Moore...

Informacje o książce

Autor

Renshen Wang

Język

Angielski

Oprawa

Książka - Miękka

Data wydania

2011

strony

EAN

9783639261233

ISBN

3639261232

Enbook ID

06833485

Wydawca

VDM Verlag

Waga

113

Wymiary

152 x 229 x 4

Pełny opis

Computer performance has been growing at an exponential rate, in its golden age, driven by the Moore's law of manufacturing technology and the advancement of computer architecture. However, the growth rate has been hit by a 'power wall' due to the physical limit on heat dissipation of silicon chips. As a result, reducing power consumption has become a focusing target for computer architects and circuit designers. In this book, we discuss two topics around this target, both on how to reduce the power for inter-communications inside the chip. The first and most direct way is to shorten the interconnect lengths, which is possible considering current chips are made of a single layer of circuits. If we build them in multiple layers, like multi-store buildings, we have a much smaller foot print, reducing interconnect distances. The second way, if the distances are already determined, is to minimize wires involved in communication actions. Given the floorplan, how to set up the wiring to enable point-to-point communications under minimum power? Both difficulties and opportunities are revealed, and both await further explorations.

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Against the Power Wall

Floorplanning and Interconnecting on Chips

Informacje o książce

Pełny opis

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